Solder printing method and solder printing head

The invention is to provide a solder printing head which can prevent a solder paste from fixing on the tip part of a nozzle. In this solder printing method, the solder paste P is fed into a space placed between a printing slope 69 and a mask M between nozzle side walls 75, and by moving the solder p...

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Bibliographic Details
Main Authors GOUKO, NORIO, TANIGUCHI, TOSHIHISA, SAKAIDA, ATSUSHI, TAKEDA, KYOICHI
Format Patent
LanguageChinese
English
Published 01.05.2008
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention is to provide a solder printing head which can prevent a solder paste from fixing on the tip part of a nozzle. In this solder printing method, the solder paste P is fed into a space placed between a printing slope 69 and a mask M between nozzle side walls 75, and by moving the solder printing head 51 ahead, the solder paste P is prevented from overflowing both sides of the printing slope 69 by both nozzle side walls 75, and by pressing the solder paste P toward the mask M by the printing slope 69, and by circulating and flowing the solder paste P between the printing slope 69 and the upper face of the mask M, the solder paste P is filled into a mask hole H.
Bibliography:Application Number: TW20070127062