Wire-bonding method for wire-bonding apparatus

• Main Authors: YANG, SONG FU, WENG, CHAO-FU, TONG, HO-MING, WEI, CHIH-NAN, TSAI, CHIA JUNG, SU, KAO MING, LEE, TECKONG, LIN, CHIANI
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder. The first wire-bonder and the second wire-bonder are used to bond at least a number of first chips inside a first area and a number of second chips inside a second area on a substrate simultaneously and respectively. The wire-bonding method includes the following steps. First, initial positioning coordinates of a first area and a second area are obtained. Next, whether the pitch between the first area and the second area is greater than a predetermined pitch is decided. When the pitch between the first area and the second area is greater than the predetermined pitch, the first wire-bonder and the second wire-bonder bond the first chips and the second chips simultaneously and respectively.