Wire-bonding method for wire-bonding apparatus
A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder. The first wire-bonder and the second wire-bonder are used to bond at least a number of first chips inside a first area and a number of second chi...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.05.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder. The first wire-bonder and the second wire-bonder are used to bond at least a number of first chips inside a first area and a number of second chips inside a second area on a substrate simultaneously and respectively. The wire-bonding method includes the following steps. First, initial positioning coordinates of a first area and a second area are obtained. Next, whether the pitch between the first area and the second area is greater than a predetermined pitch is decided. When the pitch between the first area and the second area is greater than the predetermined pitch, the first wire-bonder and the second wire-bonder bond the first chips and the second chips simultaneously and respectively. |
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Bibliography: | Application Number: TW200695140096 |