Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packages

Disclosed is a method of forming individual thin-film capacitors for embedding inside printed wiring boards or organic semiconductor package substrates, which includes removal of selective portions of the capacitor by sandblasting or other means so that the ceramic dielectric does not come in contac...

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Bibliographic Details
Main Authors ONKEN, MATTHEW T, AMEY, DANIEL IRWIN JR, MCGREGOR, DAVID ROSS, BORLAND, WILLIAM
Format Patent
LanguageChinese
English
Published 16.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosed is a method of forming individual thin-film capacitors for embedding inside printed wiring boards or organic semiconductor package substrates, which includes removal of selective portions of the capacitor by sandblasting or other means so that the ceramic dielectric does not come in contact with acid etching solutions.
Bibliography:Application Number: TW200796129392