laser beam splitting wafer system

This invention is a laser beam splitting system for singulation of semiconductor wafer. The system includes a laser head which emits a mother laser beam, and an optical component located on beam path which splits the mother beam into multiple beamlets. Another optical component focuses the beamlets...

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Bibliographic Details
Main Authors XU, YU-LIN, CHEN, HONG-LONG, LI, JI-ZHAN
Format Patent
LanguageChinese
English
Published 16.02.2008
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:This invention is a laser beam splitting system for singulation of semiconductor wafer. The system includes a laser head which emits a mother laser beam, and an optical component located on beam path which splits the mother beam into multiple beamlets. Another optical component focuses the beamlets onto the wafer to perform multiple lines dicing. A zoom optics or a rotation mechanism could be introduced to adjust the beamlets for different kinds of wafer specifications.
Bibliography:Application Number: TW20060129132