Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

• Main Authors: YU, CHEEMEN, TAKIAR, HEM, LIU, NING, CHIEN, JACKANG, CHANG, CHE-JUNG, CHIU, CHIN-TIEN
• Format: Patent
• Language: Chinese; English
• Published: 16.01.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.