Packaging of mems devices

The present invention is directed to a process for packaging a microelectrical, micromechanical, microelectromechanical (MEMS) or microfluidic component on a substrate by forming cavities made from crosslinked photoresists on an easily removable second substrate, bonding the cavities to third substr...

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Bibliographic Details
Main Authors JOHNSON, DONALD W, NAGALE, MILIND P
Format Patent
LanguageChinese
English
Published 01.01.2008
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
MICROSTRUCTURAL TECHNOLOGY
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:The present invention is directed to a process for packaging a microelectrical, micromechanical, microelectromechanical (MEMS) or microfluidic component on a substrate by forming cavities made from crosslinked photoresists on an easily removable second substrate, bonding the cavities to third substrates containing selected microdevices, then peeling off the removable second substrate.
Bibliography:Application Number: TW20070109137