Method of making a circuitized substrate having a plurality of solder connection sites thereon

A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder "islands". A solder flux is then deposited onto the "islands" causing these to spread out an...

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Bibliographic Details
Main Authors ANDERSON, STEVEN W, PALOMAKI, CHERYL L, MOORE, SCOTT P, TRAN, SON K
Format Patent
LanguageChinese
English
Published 16.10.2007
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder "islands". A solder flux is then deposited onto the "islands" causing these to spread out and form a continuous solder layer across the conductor's upper surface. The solder layer is then capable of coupling to an external conductor such as a solder ball, to form an electrical assembly such as might be used within an information handling system such as a personal computer.
Bibliography:Application Number: TW200695137377