Tungsten and molybdenum compounds and their use for chemical vapour deposition (CVD)

• Main Authors: VOLZ, KERSTIN, SUNDERMEYER, JOERG, POKOJ, MICHAEL, REUTER, KNUD, OCHS, THOMAS, MERKOULOV, ALEXEI, STOLZ, WOLFGANG
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2007
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; ORGANIC CHEMISTRY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to specific novel tungsten and molybdenum compounds, to the use thereof for the deposition of tungsten- or molybdenum-containing layers by means of chemical vapour deposition, and to tungsten- or molybdenum-containing layers produced by this process.