Method for cleaning sputter

• Main Authors: CHEN, PO-WEI, WANG, KUO-TING, TSAI, CHI-HSIUNG
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2007
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLEANING; CLEANING IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

A method for cleaning a sputter is provided. The sputter comprises a chamber, a sputtering cathode, a base, and a carrier. The sputtering cathode with a target is positioned in the chamber, and the base used to carry the substrate is positioned in the chamber and opposite to the target. The carrier is used to transport the substrate into the chamber. The present method comprises providing a monitor substrate made of material except glass and having a rough surface, using the carrier to transport the monitor substrate into the chamber and position it on the base, proceeding a sputtering process, using the carrier to carry the monitor substrate out the chamber, and recycling the monitor substrate.