Radiation-sensitive resin composition and process for producing plating shaped item

• Main Authors: IWANAGA, SHIN-ICHIRO, SAKAI, HIROKO, OHTA, MASARU, YOKOYAMA, KENICHI, ONIMARU, NAMI
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2007
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; THEIR PREPARATION OR CHEMICAL WORKING-UP

A radiation-sensitive resin composition that exhibits high sensitivity to active radiations of wide wavelength region, excelling in image resolution, etc.; a resin film formed using the composition; a transfer film having the resin film; and a process for producing a plating shaped item in which a thick plating shaped item, such as bump or wiring, can be produced with high accuracy with the use of the composition or transfer film. There is provided a negative radiation-sensitive resin composition characterized by containing alkali-soluble resin (A), compound having at least one ethylenically unsaturated double bond (B), radiation-sensitive radical polymerization initiator (C), compound having a specified anthracene structure (D) and organic solvent (E).