Chip picking up apparatus, chip picking up method, chip peeling off apparatus, and chip peeling off method

• Main Authors: NODA, KAZUHIRO, HAJI, HIROSHI, KASAI, TERUAKI, OZONO, MITSURU
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

The purpose of the invention is providing a chip picking up apparatus, a chip picking up method, a chip peeling off apparatus, and a chip peeling off method. It can pick up chip at high speed and would not cause damage to the chip. The solving means of the invention is comprising: sticking chip 6 on a slice 5; sucking and picking up chip by using a sucking mouth 20 in the chip picking up apparatus; installing sheet pusher component 24 made of flexible rubber elastomer with sphere shape on the contact supporting surface of upper surface of peeling off tool 22; making the upper push surface of the sheet push component 24 forming a flat plane and contacting according to the lower surface of thin slice 5 in the descending condition of sucking mouth 20; rising the sucking mouth 20 and chip 6 together in rising motion; making the pusher deforming into convex curved surface shape upward and pushing the lower surface of thin slice 5 upward. It can peel off the chip 6 and the thin slice 5 from the outer fringe side of