Chip with structure of bumps

• Main Authors: HE, MING-LONG, HU, JUN-PING, TSI, CHIEN-WEN
• Format: Patent
• Language: Chinese; English
• Published: 01.05.2007
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a chip with structure of bumps, including a chip, multiple pads and multiple bumps. The chip is a micro circuit formed by integrated circuit technology. The pads are metallized part of the chip for electrical connection. The bumps are metal protrusions formed on the pads for providing an electrical connecting interface between the pads of the chip and the terminal area of the other end wherein the bumps are arranged along a transverse arrangement direction and each bump includes a first block and a second block. The first block and the second block are electrically connected to each other in the vertical direction. The first block electrically connects to the pads of chip. The size of the second block along the transverse arrangement direction is larger than that of the first block. The second block is used to provide an electrical connecting interface between the chip and the terminal area of the other end wherein the first block and the second block in the adjacent bumps are a