Phosphonic acid-containing formulation for cleaning semiconductor wafer and cleaning method
To provide a semiconductor cleaning liquid composition containing phosphonic acid, and provide a relevant method of cleaning. A composition that in the operation of semiconductor wafer processing, is used for cleaning performed to remove residues; and a relevant method of cleaning. The composition c...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
16.01.2007
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor cleaning liquid composition containing phosphonic acid, and provide a relevant method of cleaning. A composition that in the operation of semiconductor wafer processing, is used for cleaning performed to remove residues; and a relevant method of cleaning. The composition comprises at least one fluorocompound (a) selected from among hydrofluoric acid, ammonium hydrogen fluoride and ammonium fluoride, phosphonic acid (b), formic acid (c), at least one organic amine (d) and water (e). Further, as an optional component of the composition, there may be added at least one member selected from the group consisting of at least one organic solvent (f), ascorbic acid (g), at least one surfactant (h) and mercapto-having at least one anticorrosive agent (I). |
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Bibliography: | Application Number: TW200695119207 |