Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices
A system and method for processing and/or cleaning substrates using sonic energy that eliminates or reduces damage to the substrates. In one aspect, the invention utilizes and produces low power density sonic energy to effectively remove particles from a substrate. In another aspect, the invention u...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.01.2007
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Subjects | |
Online Access | Get full text |
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Summary: | A system and method for processing and/or cleaning substrates using sonic energy that eliminates or reduces damage to the substrates. In one aspect, the invention utilizes and produces low power density sonic energy to effectively remove particles from a substrate. In another aspect, the invention utilizes and generates a clean electrical signal for driving a source of sonic energy, such as a transducer. |
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Bibliography: | Application Number: TW200695107855 |