Method and system for processing substrates with sonic energy that reduces or eliminates damage to semiconductor devices

A system and method for processing and/or cleaning substrates using sonic energy that eliminates or reduces damage to the substrates. In one aspect, the invention utilizes and produces low power density sonic energy to effectively remove particles from a substrate. In another aspect, the invention u...

Full description

Saved in:
Bibliographic Details
Main Authors VOHRA, VIVEK, KASHKOUSH, ISMAIL, FANI, PEJMAN, WALTER, ALAN, KORBLER, JOHN
Format Patent
LanguageChinese
English
Published 01.01.2007
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A system and method for processing and/or cleaning substrates using sonic energy that eliminates or reduces damage to the substrates. In one aspect, the invention utilizes and produces low power density sonic energy to effectively remove particles from a substrate. In another aspect, the invention utilizes and generates a clean electrical signal for driving a source of sonic energy, such as a transducer.
Bibliography:Application Number: TW200695107855