Method for preparing flexible mechanically compensated transparent layered material
The invention pertains to a method for preparing a flexible mechanically compensated layered material comprising a transparent carrier both sides of which are at least partly covered with a transparent inorganic material, comprising the consecutive steps of (a) providing two temporary substrates; (b...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.12.2006
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Subjects | |
Online Access | Get full text |
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Summary: | The invention pertains to a method for preparing a flexible mechanically compensated layered material comprising a transparent carrier both sides of which are at least partly covered with a transparent inorganic material, comprising the consecutive steps of (a) providing two temporary substrates; (b) applying a transparent inorganic material layer onto each of the temporary substrates; (c1) applying a transparent carrier onto the transparent inorganic material layers; or (c2) applying a polymerizable precursor for a transparent polymerized carrier onto the transparent inorganic material layers followed by polymerizing the polymerizable precursor to the transparent carrier; and (d) removing the temporary substrates. |
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Bibliography: | Application Number: TW200594140709 |