Testing method and method for removing solder balls
A testing method for a package substrate is provided. The package substrate has a plurality of solder balls. The testing method includes the following processes. First, a cutter is provided. Then, the cutter is moved along a surface of the package substrate for removing the solder balls from the pac...
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| Main Author | |
|---|---|
| Format | Patent |
| Language | Chinese English |
| Published |
01.10.2006
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| Online Access | Get full text |
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| Abstract | A testing method for a package substrate is provided. The package substrate has a plurality of solder balls. The testing method includes the following processes. First, a cutter is provided. Then, the cutter is moved along a surface of the package substrate for removing the solder balls from the package substrate, sequentially. Next, a reliability analysis is performed to the package substrate. The testing method can prevent the separation of the ball pads from the package substrate as removing the solder balls. Moreover, a method for removing the solder balls is provided. |
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| AbstractList | A testing method for a package substrate is provided. The package substrate has a plurality of solder balls. The testing method includes the following processes. First, a cutter is provided. Then, the cutter is moved along a surface of the package substrate for removing the solder balls from the package substrate, sequentially. Next, a reliability analysis is performed to the package substrate. The testing method can prevent the separation of the ball pads from the package substrate as removing the solder balls. Moreover, a method for removing the solder balls is provided. |
| Author | KUNG, HENG-YU |
| Author_xml | – fullname: KUNG, HENG-YU |
| BookMark | eNrjYmDJy89L5WQwDkktLsnMS1fITS3JyE9RSMxLgTHT8osUilJz88tA0sX5OSmpRQpJiTk5xTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JD4k3MjAwMzYxNLM1NGYGDUA9J8uSg |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | TW200634965A |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_TW200634965A3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 12:29:05 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | Chinese English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_TW200634965A3 |
| Notes | Application Number: TW20050108744 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061001&DB=EPODOC&CC=TW&NR=200634965A |
| ParticipantIDs | epo_espacenet_TW200634965A |
| PublicationCentury | 2000 |
| PublicationDate | 20061001 |
| PublicationDateYYYYMMDD | 2006-10-01 |
| PublicationDate_xml | – month: 10 year: 2006 text: 20061001 day: 01 |
| PublicationDecade | 2000 |
| PublicationYear | 2006 |
| RelatedCompanies | ADVANCED SEMICONDUCTOR ENGINEERING, INC |
| RelatedCompanies_xml | – name: ADVANCED SEMICONDUCTOR ENGINEERING, INC |
| Score | 2.7585626 |
| Snippet | A testing method for a package substrate is provided. The package substrate has a plurality of solder balls. The testing method includes the following... |
| SourceID | epo |
| SourceType | Open Access Repository |
| Title | Testing method and method for removing solder balls |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20061001&DB=EPODOC&locale=&CC=TW&NR=200634965A |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSTFOSzRNNUvSNUgzSdU1STNO1bVMtUjRNUo0Baam1NQ0I_BZer5-Zh6hJl4RphFMDFmwvTDgc0LLwYcjAnNUMjC_l4DL6wLEIJYLeG1lsX5SJlAo394txNZFDd47Bh0ppObiZOsa4O_i76zm7GwbEq7mFwSWA5-N7sjMwApqRoPO2XcNcwLtSilArlLcBBnYAoCm5ZUIMTBVZQgzcDrDbl4TZuDwhU54A5nQvFcswmAcAjoQIy9dAXLps0JiXgqMCWx4KhSl5oIHBxSAiSkltUghKTEnp1iUQdHNNcTZQxdoezzcq_Eh4QiHGosxsOTl56VKMCiYJJsYJCclmlqkpQA7RKDNq6bAhllKmmFaMrAKtjCTZJDCbY4UPklpBi7woAJ4eZoMA0tJUWmqLLCaLUmSA4cPADxdgbc |
| link.rule.ids | 230,309,786,891,25594,76906 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSTFOSzRNNUvSNUgzSdU1STNO1bVMtUjRNUo0Baam1NQ0I_BZer5-Zh6hJl4RphFMDFmwvTDgc0LLwYcjAnNUMjC_l4DL6wLEIJYLeG1lsX5SJlAo394txNZFDd47Bh0ppObiZOsa4O_i76zm7GwbEq7mFwSWA5-N7sjMwGoOOp0X1HQKcwLtSilArlLcBBnYAoCm5ZUIMTBVZQgzcDrDbl4TZuDwhU54A5nQvFcswmAcAjoQIy9dAXLps0JiXgqMCWx4KhSl5oIHBxSAiSkltUghKTEnp1iUQdHNNcTZQxdoezzcq_Eh4QiHGosxsOTl56VKMCiYJJsYJCclmlqkpQA7RKDNq6bAhllKmmFaMrAKtjCTZJDCbY4UPkl5Bk6PEF-feB9PP29pBi7wAAN4qZoMA0tJUWmqLLDKLUmSA4cVAHYIhKQ |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Testing+method+and+method+for+removing+solder+balls&rft.inventor=KUNG%2C+HENG-YU&rft.date=2006-10-01&rft.externalDBID=A&rft.externalDocID=TW200634965A |