Testing method and method for removing solder balls
A testing method for a package substrate is provided. The package substrate has a plurality of solder balls. The testing method includes the following processes. First, a cutter is provided. Then, the cutter is moved along a surface of the package substrate for removing the solder balls from the pac...
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| Main Author | |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.10.2006
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| Online Access | Get full text |
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| Summary: | A testing method for a package substrate is provided. The package substrate has a plurality of solder balls. The testing method includes the following processes. First, a cutter is provided. Then, the cutter is moved along a surface of the package substrate for removing the solder balls from the package substrate, sequentially. Next, a reliability analysis is performed to the package substrate. The testing method can prevent the separation of the ball pads from the package substrate as removing the solder balls. Moreover, a method for removing the solder balls is provided. |
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| Bibliography: | Application Number: TW20050108744 |