Semiconductor device and method for forming dummy vias

A semiconductor device. A dielectric layer is formed in a substrate. A dual damascene structure is filled with a conductive layer and inlaid in the dielectric layer. A dummy via structure is filled with a non-conductive material and inlaid in the dielectric layer. The dummy via structure has at leas...

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Main Authors HUANG, KUNNG, HUANG, SSU CHIA, YOU, JRNG, CHEN, TZUNG-YUAN, WANG, C. H, TSENG, HUANI, TSAI, T. L, LIOU, GUAN-MIAU
Format Patent
LanguageChinese
English
Published 01.10.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device. A dielectric layer is formed in a substrate. A dual damascene structure is filled with a conductive layer and inlaid in the dielectric layer. A dummy via structure is filled with a non-conductive material and inlaid in the dielectric layer. The dummy via structure has at least two dummy vias filled with the non-conductive material and located adjacent to two sides of the dual damascene structure respectively.
Bibliography:Application Number: TW200594143150