Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.

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Bibliographic Details
Main Authors ROELFS, BERND OTTMAR, WENZEL, RENE, YOUKHANIS, MARKUS, PLIET, THOMAS, FUJIWARA, TOSHIYA, REENTS, BERT, KIM, SOUNGSOO
Format Patent
LanguageChinese
English
Published 01.07.2006
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Summary:The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper.
Bibliography:Application Number: TW200594128784