Method for wafer-level testing photoelectric chips
A method for wafer-level testing photoelectric chips is disclosed. A plurality of photoelectric chips are formed in a wafer, and each has a light-working region on a first surface of the wafer and a plurality of contacts on a second surface of the wafer. During testing, the wafer is fixed on a suppo...
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| Main Author | |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.07.2006
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| Online Access | Get full text |
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| Summary: | A method for wafer-level testing photoelectric chips is disclosed. A plurality of photoelectric chips are formed in a wafer, and each has a light-working region on a first surface of the wafer and a plurality of contacts on a second surface of the wafer. During testing, the wafer is fixed on a support mechanism such that the first surface of the wafer faces to the support mechanism. A probing mechanism probes and presses on the second surface of the wafer to electrically contact the contacts on at least one of the photoelectric chips, so that the electrically connected photoelectric chip can be tested without optical interference. |
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| Bibliography: | Application Number: TW20040140792 |