A base material forming method and device for forming the housing of electronic products
This invention relates to a base material forming method and device for using to form the housing of electronic products. Firstly, prepare a base material and put the material on the mould; then place metal-pressing plates on the base material and hold the base material securely. Apply a pulse curre...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.07.2006
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Subjects | |
Online Access | Get full text |
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Summary: | This invention relates to a base material forming method and device for using to form the housing of electronic products. Firstly, prepare a base material and put the material on the mould; then place metal-pressing plates on the base material and hold the base material securely. Apply a pulse current on the electromagnetic coil set which is located on one side of the base material, and bring the electromagnetic coil closely to the base material so that an electromagnetic repulsion force will be generated between the coil set and the base material. The repulsion force will then activate on the base material and push the base material to deform outwardly so as to contact tightly onto the mould and to form the desired shape. When this invention is used for forming base material of low magnetic conductivity, a thin metal plate with high permeability is provided and is placed on the top of the base material so that the repulsion force will activate on the thin metal plate with high permeability and the base mater |
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Bibliography: | Application Number: TW20040141519 |