Guard ring
A guard ring used in a thin film deposition machine is provided. When a wafer is disposed on the thin film deposition machine and the guard ring is disposed around the wafer, the top surface of guard ring near the wafer isn't lower than the top surface of the wafer. Besides that, the gap betwee...
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| Main Author | |
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| Format | Patent |
| Language | Chinese English |
| Published |
16.06.2006
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| Online Access | Get full text |
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| Summary: | A guard ring used in a thin film deposition machine is provided. When a wafer is disposed on the thin film deposition machine and the guard ring is disposed around the wafer, the top surface of guard ring near the wafer isn't lower than the top surface of the wafer. Besides that, the gap between the guard ring and the wafer is less than 0.7 mm. The guard ring provided in this invention prevents the side deposition at the sidewall of the wafer. The degree of plantation and yield is enhanced in the process of the thin film deposition. |
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| Bibliography: | Application Number: TW20040137012 |