Peelable, child-resistant package for film-shaped drug forms
Package for flat, pliable objects, especially for wafer-shaped or film-shaped drug forms, having a carrier layer (6) and a cover layer (7) which is detachably connected to said carrier layer (6), wherein - the package (10) has a first surface region (1) wherein the carrier layer (6) is not connected...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.06.2006
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Subjects | |
Online Access | Get full text |
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Summary: | Package for flat, pliable objects, especially for wafer-shaped or film-shaped drug forms, having a carrier layer (6) and a cover layer (7) which is detachably connected to said carrier layer (6), wherein - the package (10) has a first surface region (1) wherein the carrier layer (6) is not connected to the cover layer (7) and which is completely surrounded by a margin area (3) wherein the carrier layer (6) is detachably connected to the cover layer (7), whereby a cavity (5), enclosed on all sides, is formed for accommodating a said object (4); - the package (10) has a second surface region (2) wherein the carrier layer (6) is not connected to the cover layer (7); - at least one perforation line (8, 8') is present which extends at least partially within the second surface region (2), said perforation being provided both in the carrier layer (6) and in the cover layer (7); - serving the perforation (8, 8') results in the formation of a free edge (12) of the cover layer (7) which serves as a gripping aid and ena |
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Bibliography: | Application Number: TW200594132625 |