Resistive radiation heater fabricated by linear cutting electric discharge machining
This invention is to use linear cutting electric discharge machining to fabricate a resistive radiation heater used to heat the bottom of a semiconductor wafer substrate. The heater comprises: a reflector plate whose bottom is a polished surface used to reflect the heat of radiation; a heater plate...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.06.2006
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Subjects | |
Online Access | Get full text |
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Summary: | This invention is to use linear cutting electric discharge machining to fabricate a resistive radiation heater used to heat the bottom of a semiconductor wafer substrate. The heater comprises: a reflector plate whose bottom is a polished surface used to reflect the heat of radiation; a heater plate made of a refractory metal and having the resistive effect, arranged at a proper position at the bottom of the reflector plate; a set of suspension components used to connect the heater plate and the reflector plate, and a power supply comprising two set of extended electrodes made of a refractory metal that are separately connected to the heater plate. By the disclosed structure above, the heater plate is used as an electrode connected to the power supply to form a current circuit, so the heater plate can be heated resistively to make the heat of the radiation emit from the surface of the heater plate to heat a semiconductor wafer substrate. This structure can make the heating have a better uniformity and can avoi |
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Bibliography: | Application Number: TW20040136403 |