Method of making camera module in wafer level
A plurality of photo-sensing device packages are provided. The packages are formed on unit substrate portions of a substrate to each include at least one photosensing semiconductor die. The substrate is formed of a material substantially transparent to light within a predetermined range of wavelengt...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
01.06.2006
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Subjects | |
Online Access | Get full text |
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