Method of making camera module in wafer level
A plurality of photo-sensing device packages are provided. The packages are formed on unit substrate portions of a substrate to each include at least one photosensing semiconductor die. The substrate is formed of a material substantially transparent to light within a predetermined range of wavelengt...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
01.06.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A plurality of photo-sensing device packages are provided. The packages are formed on unit substrate portions of a substrate to each include at least one photosensing semiconductor die. The substrate is formed of a material substantially transparent to light within a predetermined range of wavelengths, with each unit substrate portion being provided with front and backside surfaces on opposite sides thereof. Each photo-sensing semiconductor die defines at least one photo-sensing area opposing the front surface of one unit substrate portion for receiving light impinging upon its backside surface and passing therethrough. A plurality of lens housings are also provided on the substrate, each including at least one lens element disposed in optical alignment with said photo-sensing semiconductor die of one said unit substrate. The plurality of photo-packages are formed by dicing the substrate to separate the unit substrate portions one from the other. |
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Bibliography: | Application Number: TW200594129875 |