Method of making camera module in wafer level

• Main Author: KIM, DEOK-HOON
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

A plurality of photo-sensing device packages are provided. The packages are formed on unit substrate portions of a substrate to each include at least one photosensing semiconductor die. The substrate is formed of a material substantially transparent to light within a predetermined range of wavelengths, with each unit substrate portion being provided with front and backside surfaces on opposite sides thereof. Each photo-sensing semiconductor die defines at least one photo-sensing area opposing the front surface of one unit substrate portion for receiving light impinging upon its backside surface and passing therethrough. A plurality of lens housings are also provided on the substrate, each including at least one lens element disposed in optical alignment with said photo-sensing semiconductor die of one said unit substrate. The plurality of photo-packages are formed by dicing the substrate to separate the unit substrate portions one from the other.