Semiconductor manufacturing apparatus, method of manufacturing semiconductor device, and wafer stage

• Main Author: USUAMI, HIROHISA
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2005
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The objective of the present invention is to enhance the uniformity of machining accuracy in a wafer plane. A stage body 10a of a wafer stage 10 having an electrostatic attraction function is sectioned into a plurality of attraction regions 20 by a partition member 11. Each attraction region 20 is provided with electrodes 13a and 13b capable of varying an applying voltage, helium supply piping 15a, and a fluorescence thermometer 22a. Temperature distribution of a wafer W is grasped in real-time by measuring the temperature of the wafer corresponding to the plurality of attraction regions 20. Partial temperature correction of the wafer W is performed by regulating the electrostatic attraction of the attraction region 20 in correspondence with a required temperature correcting part. The uniformity of wafer processing being influenced by wafer temperature is ensured by controlling the temperature in the wafer plane and unevenness in the wafer plane of the machining accuracy of the wafer processing, for example,