Photoresist composition for a spinless coater and method of forming a photoresist pattern using the same

A photoresist composition for a spinless coater includes a novolak resin having a weight average molecular weight of about 2,000 to about 15,000, a diazide based photosensitive compound and a volatile organic solvent. The photoresist composition is applied to a substrate of a liquid crystal display...

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Bibliographic Details
Main Authors LEE, DONG-KI, JU, JIN-HO, KIM, HYO-YOUL
Format Patent
LanguageChinese
English
Published 16.03.2005
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
AUXILIARY PROCESSES IN PHOTOGRAPHY
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES
PHYSICS
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Summary:A photoresist composition for a spinless coater includes a novolak resin having a weight average molecular weight of about 2,000 to about 15,000, a diazide based photosensitive compound and a volatile organic solvent. The photoresist composition is applied to a substrate of a liquid crystal display apparatus to reduce blots and enhance application uniformity. A highly volatile solvent, such as n-propyl acetate (nPAC) or n-butyl acetate (nBA) is used in the photoresist composition as the volatile organic solvent. The photoresist composition including the volatile organic solvent gives a photoresist film that has a uniform thickness. Hence, the generation of small resin blots and thick blots may be reduced.
Bibliography:Application Number: TW20040124660