Polishing composition

• Main Authors: HAGIHARA, TOSHIYA, TAKASHINA, SHIGEAKI, YONEDA, YASUHIRO
• Format: Patent
• Language: Chinese; English
• Published: 16.11.2004
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A polishing composition comprising silica particles, polymer particles and a cationic compound in an aqueous medium; a polishing process for a substrate for a precision part with the polishing composition as defined above; a method for planarization of a substrate for a precision part, including the step of polishing the substrate for a precision part with the polishing composition as defined above; and a method for planarization of a substrate for a precision part, including the steps of polishing the substrate for a precision part with the polishing composition as defined above, the polishing composition being a first polishing composition, with applying a polishing load of 50 to 1000 hPa, and polishing the substrate after the first step with a second polishing composition comprising silica particles in an aqueous medium with applying a polishing load of 50 to 1000 hPa. The polishing composition is, for instance, useful in planarization of a semiconductor substrate having a thin film formed on its surface h