Automatic adhesion cleaning device for pot door of wafer case

• Main Author: SU, ZHAO-MING
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2004
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

An automatic adhesion cleaning device for a pot door of a wafer case comprises: a mounting platform; a first winding unit and a second winding unit separately installed on the mounting platform; a press adhesion mechanism; and a tape. The press adhesion mechanism is mounted between the first winding unit and the second winding unit and includes a base plate, a press plate, and a driving component for driving the press plate moving up-and-down relative to the base plate and defining a cleaning space. The pot door is mounted on the base plate and located in the cleaning space. The tape can advance through rolling by the first winding unit and the second winding unit, and extend through the cleaning space of the press adhesion mechanism and pass through the space above the pot door. When the press plate of the press adhesion mechanism downwardly approaches to the base plate, the press plate enables the tape to abut upon the pot door of the base plate in order to adhere the dusts on the pot door.