Polishing composition containing conducting polymer

• Main Authors: CHERIAN, ISAAC K, ZHANG, JIAN, SUN, FRED F, KLINGENBERG, ERIC H, WANG, SHUMIN
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2004
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of 10-10 S/cm to 106 S/cm, and (c) a liquid carrier.