Polishing composition containing conducting polymer

The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of 10-10 S/cm to 106 S/cm, and (c) a liquid carrier.

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Bibliographic Details
Main Authors CHERIAN, ISAAC K, ZHANG, JIAN, SUN, FRED F, KLINGENBERG, ERIC H, WANG, SHUMIN
Format Patent
LanguageChinese
English
Published 01.06.2004
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention provides a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of 10-10 S/cm to 106 S/cm, and (c) a liquid carrier.
Bibliography:Application Number: TW200392119139