Semiconductor device

The object of the present invention is to provide a semiconductor device wherein cracks of interlayer insulating films and pad peeling due to option setting are hard to occur. The said object can be achieved by supplying a voltage toward an option-setting pad. A semiconductor substrate comprises an...

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Bibliographic Details
Main Author SHIBATA, JUN
Format Patent
LanguageChinese
English
Published 16.04.2004
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The object of the present invention is to provide a semiconductor device wherein cracks of interlayer insulating films and pad peeling due to option setting are hard to occur. The said object can be achieved by supplying a voltage toward an option-setting pad. A semiconductor substrate comprises an option-setting portion 10 on the main side. The option-setting portion 10 comprises an option-setting pad 5C, which is covered by a surface-protecting film 11a on the circumferential edges that are for setting the option of the semiconductor device, and a fixed-potential pad 5D, which is covered by a surface-protecting film 11a on the circumferential edges and supplies a fixed-potential. A surface-protecting film 11b is positioned between option-setting pad 5C and fixed-potential pad 5D. The option-setting of the semiconductor device proceeds under the absence or presence of an option-setting pad 5C, a fixed-potential pad 5D, and a stud bump 15, which is formed above surface-protecting films 11a and 11b.
Bibliography:Application Number: TW200392113231