Mounting method and mounting device

The present invention provides a mounting method and a mounting device characterized that the articles being bonded are disposed oppositely, and after the bonding face of the upper article directing downward is cleaned with energy wave or energy particles, the bonding face of the lower article direc...

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Bibliographic Details
Main Authors SATORU, NARABA, AKIRA, YAMAUCHI
Format Patent
LanguageChinese
English
Published 01.03.2004
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a mounting method and a mounting device characterized that the articles being bonded are disposed oppositely, and after the bonding face of the upper article directing downward is cleaned with energy wave or energy particles, the bonding face of the lower article directing upward is cleaned, or both articles are disposed oppositely and the opposite bonding faces are cleaned or they are cleaned while inserting a partition plate between both articles. When the bonding faces of the articles are cleaned prior to bonding, contaminants removed from the bonding face are prevented effectively from re-adhering to the bonding face and highly reliable bonding is ensured by enhancing the cleaning effect.
Bibliography:Application Number: TW200392109691