Apparatus and method for interfacing electronic packages with a circuit board
An electrical socket (10) mounts a plurality of electrical contact probes (20, 22, 24, 26, 28, 30, 32) for providing an electrical connection between terminals of an electronic package (1, 1') received in a seat (10d) formed in the socket and respective conductive pads of a DUT board. The conta...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.07.2003
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Subjects | |
Online Access | Get full text |
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Summary: | An electrical socket (10) mounts a plurality of electrical contact probes (20, 22, 24, 26, 28, 30, 32) for providing an electrical connection between terminals of an electronic package (1, 1') received in a seat (10d) formed in the socket and respective conductive pads of a DUT board. The contact probes each have a slidable contact tip (20m, 26m, 28m, 30m, 32m) which is adapted for engagement with a respective terminal of an electronic package received in the socket and which is removable from the contact probe for ease of replacement. The removable contact tips or plungers are provided with a retainer surface (20t, 28t, 30t, 32t) for interengagement with a removable retainer member of the socket. |
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Bibliography: | Application Number: TW20020137394 |