METHOD OF MANUFACTURING INTERCONNECTIONS OF INTEGRATED CIRCUITS

• Main Authors: SHISHKO V.A, FAT'KIN A.A, ZAGORODNEV I.A, FISHEL' I.SH, KUZNETSOV V.O, SULIMIN A.D
• Format: Patent
• Language: English; Russian
• Published: 30.07.1994
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

FIELD: integrated circuits production. SUBSTANCE: lower level conductors are formed, as well as interlevel insulation by means of application of the first dielectric layer with thickness being equal to 0.6-0.8 thickness of interlevel insulation. Relief is smoothed over by magnetron sputtering this l...