PROCESS OF ENCAPSULATION OF MICROCIRCUITS BY PRESS-COMPOUND

• Main Authors: Katin V.S, Kalinin G.V, Stadnik A.A
• Format: Patent
• Language: English; Russian
• Published: 15.12.1994
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

FIELD: electronics. SUBSTANCE: good semiconductor crystals are mounted on lead-out frames which crystal holders are located under plane of frames. Wire leads are connected to termination pads of crystals and cross-arms of frames. Heat spreading agent is laid into sockets of lower mould for encapsula...