Multilayered mold structure for hot surface molding in a short cycle time

A multilayered insulated mold structure is provided. An insulation layer (22) provided on each of the mold cores retains heat at the molding surface, thereby increasing surface quality of the finished part. The insulating layer has a varying density across its thickness so as to have a low density c...

Full description

Saved in:
Bibliographic Details
Main Author KIM BANG MO
Format Patent
LanguageEnglish
Published 19.12.1997
Edition6
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A multilayered insulated mold structure is provided. An insulation layer (22) provided on each of the mold cores retains heat at the molding surface, thereby increasing surface quality of the finished part. The insulating layer has a varying density across its thickness so as to have a low density center region and high density surface regions. By having a relatively low density, the center region of the insulating layer has a low thermal conductivety. Thus, the insulating layer may be made from the same material as the core and still have an acceptable insulating value. The use of the same material for adjacent layers reduces the potential of delamination of the layers. The multilayered mold is compatible with passive or active heating of the molding surface.
Bibliography:Application Number: SG19960002394