SPUTTERING SYSTEMS FOR LIQUID TARGET MATERIALS
A sputtering system comprises a magnetron assembly for depositing liquid metal films on a substrate. The magnetron assembly comprises a horizontal planar magnetron with a liquid metal target, a cylindrical rotatable magnetron with a metal target and a set of one or more shields forming a chamber bet...
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Main Author | |
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Format | Patent |
Language | English |
Published |
29.05.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A sputtering system comprises a magnetron assembly for depositing liquid metal films on a substrate. The magnetron assembly comprises a horizontal planar magnetron with a liquid metal target, a cylindrical rotatable magnetron with a metal target and a set of one or more shields forming a chamber between the planar and the rotatable magnetron. |
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Bibliography: | Application Number: SG20140011605 |