SEMICONDUCTOR MECHANICAL STRUCTURE

• Main Authors: UEDA, HIDEKI, TACHIBANA, HIROAKI, KAWANO, KIYOHIKO, NOGE, HIROSHI
• Format: Patent
• Language: English
• Published: 31.05.2013
• Subjects: CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERATION; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING

SEMICONDUCTOR MECHANICAL STRUCTURE AbstractAn impact resistance is enhanced by preventing hinges from being damaged even if an impact is provided from the outside thereto in a semiconductor machine structure. An optical scanning mirror (1) comprises a movable plate (2), the pair of hinges (3) which have one ends connected to both sides of the movable plate (2), respectively, and which form one swing axis of the movable plate (2), a fixed frame (4) so disposed as to surround the movable plate (2) and supporting the other ends of the hinges (3), and stopper parts (6) formed on the fixed frame (4). When the movable plate (2) is displaced sideways, the stopper parts (6) are brought into contact with the side edges of the recesses (2e) of the movable plate (2), and the displacement of the movable plate (2) sideways is restricted. Consequently, the hinges (3) are prevented from being damaged in an impact.Fig 1