AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS

• Main Authors: LEE WAI WAH, SONG KENG YEW, GUO WEN HUA, WANG YI BIN, ZHANG XIN WEI
• Format: Patent
• Language: English
• Published: 31.05.2013
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

AUTOMATIC WIRE TAIL ADJUSTMENT SYSTEM FOR WIRE BONDERS A capillary is utilized to form the wedge wire bond comprised in a wire interconnection. A wire holding device is located above a wire clamp and the capillary to secure the wire while the wire clamp is open and not clamping ontothe wire. The wire clamp and the capillary may be lifted relative to the wire in a direction away from the wedge wire bond and towards the wire holding device so as to pay out a length of wire from the capillary. At a predetermined height of the capillary, the wire clamp is closed to clamp onto the wire, and thereafter, the capillary and wire clamp may be moved further away from the wedge wire bondto cause the wire to break away from the wedge wire bond and to form the wire tail with a desired length extending from the capillary.(FIG. 3)