POLYIMIDE RESIN COMPOSITION AND LAMINATE INCLUDING SAME

To provide a. resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viseoclasticity and flexibility at high temperatures. To attain this, a polyi ide resin composition is provided that includes a polyimide h V5 polycondcnsation unit of a tetracarboxylic a...

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Bibliographic Details
Main Authors TOMITA, YUSUKE, KIBA, SHIGEO, IIDA, KENJI, IMAGAWA, KIYOMI
Format Patent
LanguageEnglish
Published 31.05.2013
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
HUMAN NECESSITIES
HYGIENE
MEDICAL OR VETERINARY SCIENCE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES
USE OF MATERIALS AS ADHESIVES
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Summary:To provide a. resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viseoclasticity and flexibility at high temperatures. To attain this, a polyi ide resin composition is provided that includes a polyimide h V5 polycondcnsation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxyhe acid dianhydride includes an (al) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (131) aromatic diamine represented by general fo ula (2), the diamine includes an (32) aliphatic diamine represented by general f imula (3) or (4), a total amout of the (al) tetracarboxylic acid10 dianhydride and the fp If aromatic diamine is 5 to 49 mol% with respect to a total amount of the tetraearboxylie acid dianhydride and the diamine. and an amine equivalent of the polyimide is 4,000 to 70,000.[Formula 1]Q,c-m<- 9R ,o9H21\1-1:15H / )NH2RiH2N-R2-N H2 * * * (4)
Bibliography:Application Number: SG20130024799