RELIABLE INTERCONNECT INTEGRATION

• Main Authors: HUANG LIU, WIDODO JOHNNY, YIHUA WANG, WEI LU, WUPING LIU, TI OUYANG
• Format: Patent
• Language: English
• Published: 27.05.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device includes a dielectric layer in which an tipper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection. Fig. 1a