RELIABLE INTERCONNECT INTEGRATION

A semiconductor device includes a dielectric layer in which an tipper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection. Fig. 1a

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Bibliographic Details
Main Authors HUANG LIU, WIDODO JOHNNY, YIHUA WANG, WEI LU, WUPING LIU, TI OUYANG
Format Patent
LanguageEnglish
Published 27.05.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a dielectric layer in which an tipper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection. Fig. 1a
Bibliography:Application Number: SG20090071796