SEMICONDUCTOR PLUG PROTECTED BY PROTECTIVE DIELECTRIC LAYER IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME
Embodiments of 3D memory devices with a semiconductor plug protected by a dielectric layer and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including a plurality of interleaved conductor layers and dielectric layers on the substra...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
25.02.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Embodiments of 3D memory devices with a semiconductor plug protected by a dielectric layer and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate, a memory stack including a plurality of interleaved conductor layers and dielectric layers on the substrate, and a memory string extending vertically through the memory stack. The memory string includes a semiconductor plug in a lower portion of the memory string, a protective dielectric layer on the semiconductor plug, and a memory film above the protective dielectric layer and along a sidewall of the memory string. |
---|---|
Bibliography: | Application Number: SG2021110824Q |