SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE

A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold c...

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Bibliographic Details
Main Authors KESER, Lizabeth Ann, RAE, David Fraser, ALVARADO, Reynante Tamunan
Format Patent
LanguageEnglish
Published 28.12.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.
Bibliography:Application Number: SG20171108388V