SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric lay...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
29.06.2015
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Subjects | |
Online Access | Get full text |
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Summary: | Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the same. The method of manufacturing a semiconductor device includes forming an interposer including a redistribution layer and a dielectric layer on a dummy substrate, connecting a semiconductor die to the redistribution layer facing an upper portion of the interposer, encapsulating the semiconductor die by using an encapsulation, removing the dummy substrate from the interposer, and connecting a bump to the redistribution layer facing a lower portion of the interposer. |
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Bibliography: | Application Number: SG20151103639Y |