SEALABLE SHEET

The invention provides a sealing plate which has embedding property and low pollution in sealing and excellent heat resistance reliability after sealing. The sealing plate (1) is used for sealing an electronic component (51). The sealing plate successively comprises the following components to the u...

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Bibliographic Details
Main Authors Takashi HABU, Chie IINO, Yasumichi OHARA, Yuusaku SHIMIZU
Format Patent
LanguageEnglish
Published 29.10.2020
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Summary:The invention provides a sealing plate which has embedding property and low pollution in sealing and excellent heat resistance reliability after sealing. The sealing plate (1) is used for sealing an electronic component (51). The sealing plate successively comprises the following components to the upper side: a first layer (2) which contacts with the electronic component (51) in sealing the electronic component (51), and a second layer (3) exposed to the outer side, wherein the first layer (2) and the second layer (3) respectively have heat curability. The upper surface of the second layer (3)is softer than the lower surface of the first layer (2) at 90 DEG C, and the ratio between the thickness T2 of the second layer (3) and the thickness T1 of the first layer (2) satisfies a relation: 1.5 < T2/T1 < 5.
Bibliography:Application Number: SG20201002171Y