Molding Apparatus Including a Compressible Structure

• Main Authors: RAGHAVENDRA Ravindra, HO Shu Chuen, KUAH Teng Hock, SU Jian Xiong, DING Jiapei
• Format: Patent
• Language: English
• Published: 28.06.2018

MOLDING APPARATUS INCLUDING A COMPRESSIBLE STRUCTURE The invention provides a molding apparatus comprising a first mold part operative to hold a semiconductor substrate, and a second mold part having a main surface facing the first mold part. The first and second mold parts are movable relative to each other between an open arrangement and a closed arrangement. The main surface comprises portions defining a mold cavity, and a recess at least partially surrounding the mold cavity. The main surface also comprises a compressible structure located within the recess, wherein at least a portion of the compressible structure extends out of the recess towards the first mold part and is compressible into the recess when the compressible structure contacts the semiconductor substrate in the closed arrangement. The second mold part also comprises one or more air conduits operative to introduce compressed air into the mold cavity.